- is a multilayer rigid flexible printed circuit board.
- contains no polyimides or acrylic adhesives, only FR4.
- has electrical and physical properties which are exactly the same as
any other conventional multilayer printed circuit board.
- has mechanical design characteristics that are exactly the same as any
other typical rigid flexible printed circuit board.
- allows engineers to utilize volume packaging techniques rather than
being restricted by surfaces, planes and internal connectors when
packaging components.
Cost Advantages
In high volume, HVRFlex has a minimal cost impact over the comparable multilayer boards as opposed to typical rigid-flex printed circuit boards which cost 3-4 times more than comparable multilayer printed circuit boards. Additional savings realized from connector and cable elimination between boards further cost-justifies HVRFlex use.
HVRFIex™ (High Volume Rigid Flex) is a product developed by a printed circuit manufacturer, not a flex circuit manufacturer. By people familiar with the demanding environment of commercial electronics and the need for dynamic product, price and delivery performance.
HVRFIex is a rigid-flex printed circuit board that can be folded (post assembly) into nearly any configuration required to fit its final installation. By designing with this concept in mind, you can, in effect, nearly double the available real estate for components by full use of all internal space of your system and the elimination of connectors.
HVRFIex is an all FR4 epoxy glass construction, using all the same materials used by printed circuit board manufacturers and all the same processes. Therefore, performance in the assembly process is the same as any printed circuit board.
Cost premiums for the product are now also minimized compared to conventional technology and can easily be justified:
- Connector hardware is now eliminated.
- Only 1PCB is required instead of multiples.
- Easier control of MRP.
- Lower cost of assembly (fewer setups, less hardware).
